Mga Aplikasyon ng Dispensing at Coating Machine

Ang pangunahing pag-andar ngkasinungalingan ang mga dispensing at coating machinesa precision dispensing, coating, potting, at sealing—nagpapadali ng bonding, insulation, moisture protection, thermal conductivity, at structural reinforcement. Ang mga application na ito ay sumasaklaw sa isang malawak na hanay ng mga sektor, kabilang ang electronics, automotive, bagong enerhiya, mga medikal na aparato, ilaw, at pang-industriya na mga de-koryenteng kagamitan.

I. Electronics Manufacturing (Core Application Scenario)

PCB at SMT: SMT red glue fixation, wave soldering masking, PCB conformal coating, solder joint reinforcement, at component bonding.

Chip Packaging: IC encapsulation, COB bonding encapsulation, BGA underfill, at thermal/insulating adhesive coating.

Consumer Electronics: Mobile phone frame sealing, camera/receiver fixation, battery bonding, screen-to-mid-frame bonding; laptop/tablet casing sealing, FPC reinforcement, at camera module dispensing.

Mga Optical na Device: Lens bonding, filter fixation, at optical component encapsulation (gumagamit ng low-volatility/low-shrinkage adhesives).

II. Automotive Manufacturing (High-Reliability Sealing at Potting)

Pag-iilaw at Electronics: Pagse-seal/potting ng ilaw ng sasakyan, potting ng ECU/controller ng sasakyan, at coating/sealing ng sensor.

Body at Interior: Window sealing, roof/body reinforcement panel coating, dashboard/center console bonding, at wiring harness fixation/waterproofing.

Powertrain at Chassis: Filter coating, brake pad/clutch potting, radiator tank sealing, at motor coil coating.

III. Bagong Enerhiya (Mga Power Baterya + Photovoltaics + Energy Storage)

Mga Power Baterya: Battery cell encapsulation, module thermal adhesive coating, battery pack wiring harness fixation, BMS potting, at electrode lug sealing.

Photovoltaics: PV inverter thermal potting, solar junction box/module potting, frame sealing, at terminal box potting.

Pag-imbak ng Enerhiya at Mga Tambak na Nagcha-charge: Pag-potting ng baterya sa pag-iimbak ng enerhiya, pagkakabukod ng pile module sa pag-charge/thermal coating, at pag-seal ng interface ng wiring harness.